Intech Technologies - Singapore, Singapore

Intech Technologies International, based in Singapore since 2008, boasts over 15 years of experience in providing innovative prototype build, IC packaging services and assembly solutions, and semiconductor services. Our expertise in wafer preparation includes back grinding, dicing, and die sorting. Additionally, we offer die attach and wire bonding services using aluminum and gold. Our capabilities extend to reliable semiconductor failure analysis, further bolstering product reliability and quality. Having successfully executed over 200 device production runs and over 1,000 unique assembly jobs, we’ve catered to a diverse customer base, including over 1,200 satisfied customers, with a significant focus on serving universities and research institutes globally.